E. Sun Commercial Bank (玉山銀行), the banking arm of E. Sun Financial Holding Co (玉山金控), yesterday announced plans to buy a 70 percent stake in Phnom Penh, Cambodia-based Union Commercial Bank PLC (UCB) for US$69.33 million to facilitate its expansion into Southeast Asia.
“We decided to buy a stake in UCB, rather than set up a branch in Cambodia after discovering that USB shares similar ideas about business development with E. Sun Bank,” E. Sun Financial president Joseph Huang (黃男州) told reporters at the Taiwan Stock Exchange.
Created in 1994 in the Cambodian capital, UCB has five branches focused on savings, lending and credit card businesses, Huang said.
UCB had US$330 million in assets as of December last year, the eighth-largest bank in Cambodia with a market share of 3.2 percent, Huang said.
“E. Sun Bank intends to copy its business model in Taiwan at the Cambodian lender to help boost its financial proficiency and scale of economies,” he said.
The investment came as bank-oriented E. Sun Financial seeks to expand its service network in Asia, after establishing branches in Singapore and Dongguan, China, last year.
The conglomerate also plans forays into Vietnam, Myanmar and Australia to take advantage of the region’s rapid economic growth.
The deal still needs to be approved by the regulators in Taiwan and Cambodia, Huang said.
Earlier this month, E. Sun Financial said it is looking to increase its loan book and fee income by a double-digit percentage this year, driven mainly by a thriving credit card business and better ties with small and medium-sized enterprises.
The company posted NT$7.06 billion in net profits last year, more than double the level in 2011, as its focus on the mass market paid off, a company report said.
Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) has secured three construction permits for its plan to build a state-of-the-art A14 wafer fab in Taichung, and is likely to start construction soon, the Central Taiwan Science Park Bureau said yesterday. Speaking with CNA, Wang Chun-chieh (王俊傑), deputy director general of the science park bureau, said the world’s largest contract chipmaker has received three construction permits — one to build a fab to roll out sophisticated chips, another to build a central utility plant to provide water and electricity for the facility and the other to build three office buildings. With the three permits, TSMC
The DBS Foundation yesterday announced the launch of two flagship programs, “Silver Motion” and “Happier Caregiver, Healthier Seniors,” in partnership with CCILU Ltd, Hondao Senior Citizens’ Welfare Foundation and the Garden of Hope Foundation to help Taiwan face the challenges of a rapidly aging population. The foundation said it would invest S$4.91 million (US$3.8 million) over three years to foster inclusion and resilience in an aging society. “Aging may bring challenges, but it also brings opportunities. With many Asian markets rapidly becoming super-aged, the DBS Foundation is working with a regional ecosystem of like-minded partners across the private, public and people sectors
RUN IT BACK: A succesful first project working with hyperscalers to design chips encouraged MediaTek to start a second project, aiming to hit stride in 2028 MediaTek Inc (聯發科), the world’s biggest smartphone chip supplier, yesterday said it is engaging a second hyperscaler to help design artificial intelligence (AI) accelerators used in data centers following a similar project expected to generate revenue streams soon. The first AI accelerator project is to bring in US$1 billion revenue next year and several billion US dollars more in 2027, MediaTek chief executive officer Rick Tsai (蔡力行) told a virtual investor conference yesterday. The second AI accelerator project is expected to contribute to revenue beginning in 2028, Tsai said. MediaTek yesterday raised its revenue forecast for the global AI accelerator used
BREAKTHROUGH TECH: Powertech expects its fan-out PLP system to become mainstream, saying it can offer three-times greater production throughput Chip packaging service provider Powertech Technology Inc (力成科技) plans to more than double its capital expenditures next year to more than NT$40 billion (US$1.31 billion) as demand for its new panel-level packaging (PLP) technology, primarily used in chips for artificial intelligence (AI) applications, has greatly exceeded what it can supply. A significant portion of the budget, about US$1 billion, would be earmarked for fan-out PLP technology, Powertech told investors yesterday. Its heavy investment in fan-out PLP technology over the past 10 years is expected to bear fruit in 2027 after the technology enters volume production, it said, adding that the tech would