Foxconn Technology Group (富士康科技集團) yesterday said it planned to spend 1 billion reais (US$494 million) to build new factories in Brazil that will be tasked with manufacturing Apple’s iPhones and iPads, among other electronic components, making it the group’s latest overseas investment.
The announcement came 15 months after group chairman Terry Gou (郭台銘) revealed that Foxconn was in talks with Brazil’s government to build factories to make tablet computers.
Gou said the group would collaborate with its clients in search of new growth in emerging markets such as Brazil, Russia and South Africa, which is part of the group’s five-year program to spur growth.
With the 1 billion reais investment, Foxconn will open five factories in an industrial park in Itu, a city near Sao Paulo, said Simon Hsing (邢治平), spokesman of Foxconn’s flagship company Hon Hai Precision Industry Co Ltd (鴻海精密).
The new facilities are scheduled to crank out their first batch of products in 2014 and are expected to reach full capacity by 2016, Foxconn said, confirming a report by the Agencia Estado news agency on Tuesday.
Foxconn said it also planned to manufacture cables, cameras, touch-sensor glass, LED products, printed-circuit boards (PCBs) and other components.
The investment will create 10,000 jobs, Gou told shareholders, adding that Foxconn had already hired about 6,000 workers in Brazil.
Foxconn now assembles Apple products at a plant in Jundiai and operates four other plants in Sao Paulo and three plants in other states of the Latin American country.
Foxconn’s Brazil unit chief executive officer Henry Cheng (鄭家純) is set to sign a memorandum of understanding with Luciano Almeida, president of Investe Sao Paulo, at the Palacio dos Bandeirantes, Hsing said.
Investe Sao Paulo is the gateway for foreign companies that intend to settle their operations in the state of Sao Paulo. Hsing said the technology group would not benefit from special tax incentives from the state government of Sao Paulo.
Gou said in June last year that he was in discussion with the Brazilian government to help the country build a technology center and build an electronics supply chain. He said 14 Taiwanese companies, including Acer Inc (宏碁) and Asustek Computer Inc (華碩), had agreed to join this program.
As part of that program, China’s biggest PC brand, Lenovo Group Ltd (聯想), has announced a plan to build a plant in Itu, Agencia Estado quoted Almeida as saying in Tuesday’s report.
Hon Hai shares rose 0.83 percent to NT$96.9 yesterday in Taipei trading yesterday, out-performing the benchmark TAIEX, which gained 0.62 percent.
GROWING OWINGS: While Luxembourg and China swapped the top three spots, the US continued to be the largest exposure for Taiwan for the 41st consecutive quarter The US remained the largest debtor nation to Taiwan’s banking sector for the 41st consecutive quarter at the end of September, after local banks’ exposure to the US market rose more than 2 percent from three months earlier, the central bank said. Exposure to the US increased to US$198.896 billion, up US$4.026 billion, or 2.07 percent, from US$194.87 billion in the previous quarter, data released by the central bank showed on Friday. Of the increase, about US$1.4 billion came from banks’ investments in securitized products and interbank loans in the US, while another US$2.6 billion stemmed from trust assets, including mutual funds,
Micron Memory Taiwan Co (台灣美光), a subsidiary of US memorychip maker Micron Technology Inc, has been granted a NT$4.7 billion (US$149.5 million) subsidy under the Ministry of Economic Affairs A+ Corporate Innovation and R&D Enhancement program, the ministry said yesterday. The US memorychip maker’s program aims to back the development of high-performance and high-bandwidth memory chips with a total budget of NT$11.75 billion, the ministry said. Aside from the government funding, Micron is to inject the remaining investment of NT$7.06 billion as the company applied to participate the government’s Global Innovation Partnership Program to deepen technology cooperation, a ministry official told the
Taiwan Semiconductor Manufacturing Co (TSMC, 台積電), the world’s leading advanced chipmaker, officially began volume production of its 2-nanometer chips in the fourth quarter of this year, according to a recent update on the company’s Web site. The low-key announcement confirms that TSMC, the go-to chipmaker for artificial intelligence (AI) hardware providers Nvidia Corp and iPhone maker Apple Inc, met its original roadmap for the next-generation technology. Production is currently centered at Fab 22 in Kaohsiung, utilizing the company’s first-generation nanosheet transistor technology. The new architecture achieves “full-node strides in performance and power consumption,” TSMC said. The company described the 2nm process as
JOINT EFFORTS: MediaTek would partner with Denso to develop custom chips to support the car-part specialist company’s driver-assist systems in an expanding market MediaTek Inc (聯發科), the world’s largest mobile phone chip designer, yesterday said it is working closely with Japan’s Denso Corp to build a custom automotive system-on-chip (SoC) solution tailored for advanced driver-assistance systems and cockpit systems, adding another customer to its new application-specific IC (ASIC) business. This effort merges Denso’s automotive-grade safety expertise and deep vehicle integration with MediaTek’s technologies cultivated through the development of Media- Tek’s Dimensity AX, leveraging efficient, high-performance SoCs and artificial intelligence (AI) capabilities to offer a scalable, production-ready platform for next-generation driver assistance, the company said in a statement yesterday. “Through this collaboration, we are bringing two