Apple’s iPod Touch was named “Gadget of the Year” on Friday in the UK at the second annual gadget awards event hosted by the consumer electronics publication T3 and sponsored by personal navigation device (PND) manufacturer Garmin Ltd.
Readers could vote on creative design and technical innovation through an online poll conducted from May through last month on the UK magazine’s Web site.
There were 15 categories in the 2008 Garmin T3 Gadget Awards, most with humorous titles such as: Gadget You Can’t Live Without, Drop-Dead Gorgeous Award, Best Gadget Candy and the prized Gadget of the Year.
Apple products won several awards. Apple Computers won Gadget of the Year and Best Music Gadget with its 32-gigabyte version of the second-generation iPod Touch, and took home the Gadget Candy Award with its MacAir ultra-thin laptop.
Apple’s iPhone also won Commuter Gadget of the Year.
Another big winner was Sony Corp. Sony’s XEL-1 organic light emitting diode (OLED) television won Innovation of the Year, its Sky high-definition (HD) box won Home Gadget of the Year and its PlayStation 3 game console took home the High Def Award.
Nintendo’s Wii Fit game took home the Best Gaming Gadget title, while video game Guitar Hero III won Toy of the Year. TomTom’s G930 won the navigation category.
Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) is accelerating capacity expansion fivefold this year, but it is still unable to keep up with the booming demand for artificial intelligence (AI), TSMC deputy cochief operating officer Cliff Hou (侯永清) said yesterday. This year alone, the company is building 25 chip manufacturing fabs and advanced packaging facilities worldwide, including 13 plants in Taiwan, which is unprecedented, Hou said at a CEO Summit fireside chat at Semicon Taiwan in Taipei. In the past, the company was able to build five or six factories a year, said Hou, who is also chairman of the Taiwan Semiconductor Industry
EXPANSION: The 3-hectare site would include small clean rooms and laboratories as well as a world-class training base for advanced packaging talent, the company said Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) is to establish a presence in the Baipu Industrial Park (白埔產業園區) in Kaohsiung to accelerate the testing and validation of semiconductor materials and equipment, a company executive said on Tuesday. The company is working with the Ministry of Economic Affairs and the Kaohsiung City Government on the plan, which is expected to improve validation efficiency by 25 to 50 percent, TSMC vice president of advanced packaging technology and service Jun He (何軍) said at a 3D IC global summit held ahead of the Semicon Taiwan trade show, which opened in Taipei yesterday. TSMC would also conduct
Visitors look at a 64-qubit superconducting quantum computer on display at the Fujitsu booth at the Semicon Taiwan trade show in Taipei yesterday.
Silicon photonics would play a dominant role next year and make chip-level co-packaged optics (CPO) packaging possible, Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) said yesterday. “For years, critics questioned the reliability of CPO. The doubts are being thoroughly dismantled by real-world data and market validation,” TSMC vice president of advanced packaging technology development K.C. Hsu (徐國晉) said at a SEMI forum in Taipei. The company is on track to enter production of CPO later this year, Hsu said in another forum arranged by Imec in Taipei yesterday, about four months after TSMC announced its progress in CPO development in May.
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