Dell Inc, the world's second-biggest maker of personal computers, will sell models equipped with Linux software in China this year, offering a cheaper alternative to Microsoft Corp's Windows in the second-largest PC market.
The company will begin selling computers running Linux software from Novell Inc, Theresa Shen, a Beijing-based spokeswoman for Dell, said by telephone yesterday. Round Rock, Texas-based Dell hasn't set a specific date, she said.
Linux may help chief executive officer Michael Dell cut prices and costs as he seeks to regain the top spot in the global computer market from Hewlett-Packard Co. Dell joins Hewlett-Packard and Lenovo Group Ltd (
Dell has said it began sales of Linux-based computers in the US in May, after receiving "overwhelming" requests through a Web site set up in February for customer suggestions. The company began selling a desktop and a laptop model in Europe this month using Canonical Ltd's Ubuntu Linux software, Shen said.
Dell hasn't decided how many models in China will be installed with Linux, Shen said. She declined to comment on pricing.
Hewlett-Packard, which has led Dell in the PC market for four consecutive quarters, already installs Linux on some of its PCs in China and Latin America. China's Lenovo, the third-largest PC maker, will begin selling Linux laptops in the fourth quarter.
LIMITED IMPACT: Investor confidence was likely sustained by its relatively small exposure to the Chinese market, as only less advanced chips are made in Nanjing Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) saw its stock price close steady yesterday in a sign that the loss of the validated end user (VEU) status for its Nanjing, China, fab should have a mild impact on the world’s biggest contract chipmaker financially and technologically. Media reports about the waiver loss sent TSMC down 1.29 percent during the early trading session yesterday, but the stock soon regained strength and ended at NT$1,160, unchanged from Tuesday. Investors’ confidence in TSMC was likely built on its relatively small exposure to the Chinese market, as Chinese customers contributed about 9 percent to TSMC’s revenue last
With this year’s Semicon Taiwan trade show set to kick off on Wednesday, market attention has turned to the mass production of advanced packaging technologies and capacity expansion in Taiwan and the US. With traditional scaling reaching physical limits, heterogeneous integration and packaging technologies have emerged as key solutions. Surging demand for artificial intelligence (AI), high-performance computing (HPC) and high-bandwidth memory (HBM) chips has put technologies such as chip-on-wafer-on-substrate (CoWoS), integrated fan-out (InFO), system on integrated chips (SoIC), 3D IC and fan-out panel-level packaging (FOPLP) at the center of semiconductor innovation, making them a major focus at this year’s trade show, according
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