A top World Trade Organization (WTO) official warned on Friday that a growing web of regional trading agreements threatens to wreck global trade negotiations.
"There are more voices saying we are not interested in multilateral arrangements and this can be extremely unhealthy and it is time we did something on this," said Stuart Harbinson, director in the office of WTO chief Supachai Panitchpakdi.
There are now 150 regional trading agreements in force, he told business leaders at a conference being held parallel to a weekend Asia-Pacific political summit in the Chilean capital Santiago.
Another 70 were in the works and by the end of 2007, the total could snowball to 300, he said.
The spread of such deals would distract attention from and dampen the force behind the main WTO trade talks, launched in Doha, Qatar in 2001, to open up farm, industrial and services sectors, Harbinson said.
"This expanding web of RTAs (regional trading arrangements) raises the question of the workability of parallel multilateral approaches," Harbinson said.
Unlike WTO trade rules, which are standard across the world, bilateral and other regional free trade agreements vary widely and are largely discriminatory against other partners. They also tended to jack up production costs because businesses have to comply with a variety of trading rules.
Prominent US economist Fred Bergsten warned that regional trading arrangements threatened to produce trading blocs centering around Europe, the Americas and Asia and eventually create a "dangerous" tripolar trading system and trade wars.
The US, for example, stands to lose exports totalling some US$25 billion a year if an East Asian Free Trade plan becomes a reality, he warned at the conference Friday.
Nevertheless, free trade agreements were a key insurance against any failure of of current multilateral trade talks, said Bergsten, director of the Washington-based Institute for International Economics.
"The prospects for the Doha round are uncertain," he said.
The round is aimed at a binding international treaty among 148 WTO nations, but disagreements over how to proceed in key areas such as agriculture have bogged down negotiations.
Leaders of the APEC forum who meet in Santiago at the weekend are expected to discuss a business leaders' proposal for the creation of a Free Trade Area of the Asia-Pacific embracing the giant trading groups of the Americas and East Asia.
With this year’s Semicon Taiwan trade show set to kick off on Wednesday, market attention has turned to the mass production of advanced packaging technologies and capacity expansion in Taiwan and the US. With traditional scaling reaching physical limits, heterogeneous integration and packaging technologies have emerged as key solutions. Surging demand for artificial intelligence (AI), high-performance computing (HPC) and high-bandwidth memory (HBM) chips has put technologies such as chip-on-wafer-on-substrate (CoWoS), integrated fan-out (InFO), system on integrated chips (SoIC), 3D IC and fan-out panel-level packaging (FOPLP) at the center of semiconductor innovation, making them a major focus at this year’s trade show, according
DEBUT: The trade show is to feature 17 national pavilions, a new high for the event, including from Canada, Costa Rica, Lithuania, Sweden and Vietnam for the first time The Semicon Taiwan trade show, which opens on Wednesday, is expected to see a new high in the number of exhibitors and visitors from around the world, said its organizer, SEMI, which has described the annual event as the “Olympics of the semiconductor industry.” SEMI, which represents companies in the electronics manufacturing and design supply chain, and touts the annual exhibition as the most influential semiconductor trade show in the world, said more than 1,200 enterprises from 56 countries are to showcase their innovations across more than 4,100 booths, and that the event could attract 100,000 visitors. This year’s event features 17
SEMICONDUCTOR SERVICES: A company executive said that Taiwanese firms must think about how to participate in global supply chains and lift their competitiveness Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) yesterday said it expects to launch its first multifunctional service center in Pingtung County in the middle of 2027, in a bid to foster a resilient high-tech facility construction ecosystem. TSMC broached the idea of creating a center two or three years ago when it started building new manufacturing capacity in the US and Japan, the company said. The center, dubbed an “ecosystem park,” would assist local manufacturing facility construction partners to upgrade their capabilities and secure more deals from other global chipmakers such as Intel Corp, Micron Technology Inc and Infineon Technologies AG, TSMC said. It
EXPORT GROWTH: The AI boom has shortened chip cycles to just one year, putting pressure on chipmakers to accelerate development and expand packaging capacity Developing a localized supply chain for advanced packaging equipment is critical for keeping pace with customers’ increasingly shrinking time-to-market cycles for new artificial intelligence (AI) chips, Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) said yesterday. Spurred on by the AI revolution, customers are accelerating product upgrades to nearly every year, compared with the two to three-year development cadence in the past, TSMC vice president of advanced packaging technology and service Jun He (何軍) said at a 3D IC Global Summit organized by SEMI in Taipei. These shortened cycles put heavy pressure on chipmakers, as the entire process — from chip design to mass