Several bankers yesterday lauded President Chen Shui-bian's (
At a recent meeting with his top economics advisors, Chen said he hopes to reduce the number of state-run banks to six by the end of next year, while increasing the market share of three domestic banks to above 10 percent.
He also proposed halving the number of financial holding companies in 2006 while encouraging at least one domestic bank to list shares in an overseas stock market or to turn its management over to a foreign owner.
"Those will be very important milestones to achieve, but it's a question of how," Citigroup Global Markets Taiwan Ltd chairman Tu Ying-tzyong (
Tu said that the government should use market capitalization, instead of market share, to gauge the health of domestic banks. Market cap, which is derived by multiplying a com-pany's share price by its number of shares outstanding, is a quick way of putting a price tag on a company.
"The local financial market will still be overcrowded with seven financial holding companies if they are not turning a profit," Tu said.
The best approach would be to nurture at least two to three domestic financial-service companies to become regional players in the Asia-Pacific markets with a market cap of over US$20 billion, he said.
Despite the difficulties involved, four to five leading, innovative domestic banks should also be developed, while the nation's remaining financial institutions should be encouraged to transform themselves into niche banks, Tu said.
First Financial Holding Co (
However, Huang said that the government should encourage mer-gers to create synergy, rather than just halving the number of banks as a means of addressing the nation's over-banking plight.
He also expressed concern over the foreign-ownership proposal, citing a bad experience when First Financial was accused of inappropriately profiting foreign investors in its issuance of global depository receipts (GDRs) to attract foreign investors earlier this year.
"There should be concrete supporting measures to implement the government's consolidation goals," Huang said.
Peng suggested that the government come up with "carrot-and-stick" measures, such as tax breaks and branch licenses, to motivate the private sector to meet the government's goals.
The government will face great challenges in merging state-run banks, as it will be very painful for them to rationalize costs by laying off employees and shutting down redundant branches, he said.
Joseph Lyu (
Market forces will naturally edge non-performing banks out of the marketplace, allowing leading banks to compete with their regional competitors, Lyu said.
Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) secured a record 70.2 percent share of the global foundry business in the second quarter, up from 67.6 percent the previous quarter, and continued widening its lead over second-placed Samsung Electronics Co, TrendForce Corp (集邦科技) said on Monday. TSMC posted US$30.24 billion in sales in the April-to-June period, up 18.5 percent from the previous quarter, driven by major smartphone customers entering their ramp-up cycle and robust demand for artificial intelligence chips, laptops and PCs, which boosted wafer shipments and average selling prices, TrendForce said in a report. Samsung’s sales also grew in the second quarter, up
LIMITED IMPACT: Investor confidence was likely sustained by its relatively small exposure to the Chinese market, as only less advanced chips are made in Nanjing Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) saw its stock price close steady yesterday in a sign that the loss of the validated end user (VEU) status for its Nanjing, China, fab should have a mild impact on the world’s biggest contract chipmaker financially and technologically. Media reports about the waiver loss sent TSMC down 1.29 percent during the early trading session yesterday, but the stock soon regained strength and ended at NT$1,160, unchanged from Tuesday. Investors’ confidence in TSMC was likely built on its relatively small exposure to the Chinese market, as Chinese customers contributed about 9 percent to TSMC’s revenue last
With this year’s Semicon Taiwan trade show set to kick off on Wednesday, market attention has turned to the mass production of advanced packaging technologies and capacity expansion in Taiwan and the US. With traditional scaling reaching physical limits, heterogeneous integration and packaging technologies have emerged as key solutions. Surging demand for artificial intelligence (AI), high-performance computing (HPC) and high-bandwidth memory (HBM) chips has put technologies such as chip-on-wafer-on-substrate (CoWoS), integrated fan-out (InFO), system on integrated chips (SoIC), 3D IC and fan-out panel-level packaging (FOPLP) at the center of semiconductor innovation, making them a major focus at this year’s trade show, according
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