Amid a family squabble over who is the rightful chair of Shinkong Synthetic Fibers Corp (新纖), self-proclaimed chairman Thomas Wu (吳東亮) yesterday said in a statement that he would choose social justice over family fairness now that those two principles are at odds.
His statement was read at a press conference that was called by Shinkong Synthetic Fibers general manager Wei Chung-liang (
The previous day, Wu's mother, Wu Kuei-lan (吳桂蘭), had issued a press release demanding that her third son to give up the chairmanship to his younger brother, Eric Wu (吳東昇).
As the power struggle within the Wu family intensified, Wei and Ku reiterated yesterday that Thomas Wu's election by the board members was in line with legal procedures and conditions.
"Thomas Wu said he must be responsible for the employees, shareholders and society, and therefore he refuses to give up running Shinkong Synthetic Fibers because of family pressure," the statement said.
Shinkong Synthetic Fibers was established in 1976 by the late chairman Wu Ho-su (
The company was formed in collaboration with Toray Industries Inc and the Mitsubishi Corp of Japan.
With capital of NT$12.92 billion (US$379 million), the company manufactures polyester and various types of engineering plastics products.
The chairmanship dispute follows a board meeting held on Friday at which board members elected Thomas Wu to head Shinkong Synthetic Fibers.
Thomas Wu is also chairman of Taishin Financial Holding Co (
The election ran afoul of the Wu family's earlier decision and angered the mother, who chaired another board meeting later on Friday and appointed Eric Wu to be the "real" chairman.
At yesterday's press conference, Ku said that if board members have any doubts about the election result, they should address the issue through the legal system.
With this year’s Semicon Taiwan trade show set to kick off on Wednesday, market attention has turned to the mass production of advanced packaging technologies and capacity expansion in Taiwan and the US. With traditional scaling reaching physical limits, heterogeneous integration and packaging technologies have emerged as key solutions. Surging demand for artificial intelligence (AI), high-performance computing (HPC) and high-bandwidth memory (HBM) chips has put technologies such as chip-on-wafer-on-substrate (CoWoS), integrated fan-out (InFO), system on integrated chips (SoIC), 3D IC and fan-out panel-level packaging (FOPLP) at the center of semiconductor innovation, making them a major focus at this year’s trade show, according
DEBUT: The trade show is to feature 17 national pavilions, a new high for the event, including from Canada, Costa Rica, Lithuania, Sweden and Vietnam for the first time The Semicon Taiwan trade show, which opens on Wednesday, is expected to see a new high in the number of exhibitors and visitors from around the world, said its organizer, SEMI, which has described the annual event as the “Olympics of the semiconductor industry.” SEMI, which represents companies in the electronics manufacturing and design supply chain, and touts the annual exhibition as the most influential semiconductor trade show in the world, said more than 1,200 enterprises from 56 countries are to showcase their innovations across more than 4,100 booths, and that the event could attract 100,000 visitors. This year’s event features 17
Germany is to establish its first-ever national pavilion at Semicon Taiwan, which starts tomorrow in Taipei, as the country looks to raise its profile and deepen semiconductor ties with Taiwan as global chip demand accelerates. Martin Mayer, a semiconductor investment expert at Germany Trade & Invest (GTAI), Germany’s international economic promotion agency, said before leaving for Taiwan that the nation is a crucial partner in developing Germany’s semiconductor ecosystem. Germany’s debut at the international semiconductor exhibition in Taipei aims to “show presence” and signal its commitment to semiconductors, while building trust with Taiwanese companies, government and industry associations, he said. “The best outcome
Semiconductor equipment billings in Taiwan are expected to double this year, as manufacturers in the industry are keen to expand production to meet strong global demand for artificial intelligence applications, according to SEMI, which represents companies in the electronics manufacturing and design supply chain. Speaking at a news conference before the opening of Semicon Taiwan trade show tomorrow, SEMI director of industry research and statistics Clark Tseng (曾瑞榆) said semiconductor equipment billings in Taiwan are expected to grow by an annual 100 percent this year, beating an earlier estimate of 70 percent growth. He said that Taiwan received a boost from a
RSS