The Ministry of the Interior yesterday approved a development project to expand the Central Taiwan Science Park (中部科學園區), paving the way for Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) to build an advanced 1.4-nanometer fab next year.
The project is crucial for the nation’s semiconductor industry in terms of next-generation technology and capacity, the Central Taiwan Science Park Bureau said in a statement.
The bureau expects to hand over the land to interested semiconductor companies by the end of June next year, when the Taichung City Government completes land appropriation.
Photo courtesy of the Central Taiwan Science Park Bureau via CNA
Taichung Mayor Lu Shiow-yen (盧秀燕) earlier this month told reporters that TSMC had agreed to build an advanced fab, likely using 1.4-nanometer technology, in the expanded Central Taiwan Science Park after the chipmaker suffered a setback in October in building an advanced fab in the Longtan (龍潭) section of Hsinchu Science Park (新竹科學園區) due to strong opposition by local residents.
The bureau said that a majority, or about 76 percent, of the 89.75 hectares to be appropriated is owned by a golf course operator, adding that the central and local governments would work together to solve issues concerning the golf course employees and compensation to members.
Government agencies, including the Ministry of National Defense, own about 13 percent of the land, the bureau said.
If the new project moves forward smoothly, it would generate NT$485.7 billion (US$15.6 billion) in annual production value and create 4,500 jobs upon completion, the bureau said.
Several companies from the semiconductor supply chain have expressed an interest in building operations there, it said.
Separately, MediaTek Inc (聯發科) yesterday said it would work closely with TSMC to produce its new flagship smartphone chips using 3-nanometer technology next year.
“Leading-edge technologies are very complicated and it is difficult for the company to switch [foundry] partners,” MediaTek chief executive officer Rick Tsai (蔡力行) told reporters when asked if the smartphone chip designer is considering a second source, such as Intel Corp or Samsung Electronics Co.
MediaTek has been working with Intel to produce chips using the latter’s 16-nanometer technology, Tsai said.
GROWING OWINGS: While Luxembourg and China swapped the top three spots, the US continued to be the largest exposure for Taiwan for the 41st consecutive quarter The US remained the largest debtor nation to Taiwan’s banking sector for the 41st consecutive quarter at the end of September, after local banks’ exposure to the US market rose more than 2 percent from three months earlier, the central bank said. Exposure to the US increased to US$198.896 billion, up US$4.026 billion, or 2.07 percent, from US$194.87 billion in the previous quarter, data released by the central bank showed on Friday. Of the increase, about US$1.4 billion came from banks’ investments in securitized products and interbank loans in the US, while another US$2.6 billion stemmed from trust assets, including mutual funds,
AI TALENT: No financial details were released about the deal, in which top Groq executives, including its CEO, would join Nvidia to help advance the technology Nvidia Corp has agreed to a licensing deal with artificial intelligence (AI) start-up Groq, furthering its investments in companies connected to the AI boom and gaining the right to add a new type of technology to its products. The world’s largest publicly traded company has paid for the right to use Groq’s technology and is to integrate its chip design into future products. Some of the start-up’s executives are leaving to join Nvidia to help with that effort, the companies said. Groq would continue as an independent company with a new chief executive, it said on Wednesday in a post on its Web
JOINT EFFORTS: MediaTek would partner with Denso to develop custom chips to support the car-part specialist company’s driver-assist systems in an expanding market MediaTek Inc (聯發科), the world’s largest mobile phone chip designer, yesterday said it is working closely with Japan’s Denso Corp to build a custom automotive system-on-chip (SoC) solution tailored for advanced driver-assistance systems and cockpit systems, adding another customer to its new application-specific IC (ASIC) business. This effort merges Denso’s automotive-grade safety expertise and deep vehicle integration with MediaTek’s technologies cultivated through the development of Media- Tek’s Dimensity AX, leveraging efficient, high-performance SoCs and artificial intelligence (AI) capabilities to offer a scalable, production-ready platform for next-generation driver assistance, the company said in a statement yesterday. “Through this collaboration, we are bringing two
Even as the US is embarked on a bitter rivalry with China over the deployment of artificial intelligence (AI), Chinese technology is quietly making inroads into the US market. Despite considerable geopolitical tensions, Chinese open-source AI models are winning over a growing number of programmers and companies in the US. These are different from the closed generative AI models that have become household names — ChatGPT-maker OpenAI or Google’s Gemini — whose inner workings are fiercely protected. In contrast, “open” models offered by many Chinese rivals, from Alibaba (阿里巴巴) to DeepSeek (深度求索), allow programmers to customize parts of the software to suit their