MediaTek Inc (聯發科) yesterday said it would adopt next-generation 3-nanometer technology developed by Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) for its new chips in a bid to consolidate its competitive edge.
The Hsinchu-based chip designer’s remarks came after speculation that Apple Inc might stick to 5-nanometer, rather than adopting TSMC’s 3-nanometer technology for its new iPhone series next year, due to unknown production problems.
TSMC has said that it is on track to increase production of 3-nanometer chips in the second half of next year.
Photo: Vanessa Cho, Taipei Times
MediaTek’s strategy is to enhance its competitiveness by collaborating with its major foundry partner, TSMC, a company executive said.
“We are not going to veer in a different direction... It is something we must do [to hold off the] competition,” MediaTek vice chairman and chief executive officer Rick Tsai (蔡力行) told a media briefing in Taipei.
“We have tapped 5-nanometer and 4-nanometer technologies to make our products. We think that 3-nanometer will certainly be next. We are working closely with TSMC,” Tsai said, declining to disclose a timeline.
MediaTek would further their cooperation by shifting to TSMC’s advanced chip packaging technology, dubbed chiplet, from existing 3D chip packaging technology.
Commenting on the lingering global chip shortage, Tsai said that supply next year would remain tight.
Tsai said that he does not expect to gain a clear picture of the supply-demand dynamics until 2023, when the world’s major foundries significantly ramp up new production.
For MediaTek, chip scarcity has been “manageable, but for the industry as a whole, it is a grave issue,” he said.
MediaTek last month told investors that it had a sufficient supply of chips to meet its business needs next year.
Given the company’s strong growth in 5G chips, Tsai said that MediaTek would be interested in using chips made at TSMC’s planned Kaohsiung factory.
TSMC’s board of directors approved the capacity expansion plan last week.
“The 5G market is growing beyond China next year, which will create a good opportunity for the company,” Tsai said.
MediaTek said that it expects to capture more than 35 percent of the Android-based smartphone market in North America.
The global 5G penetration rate next year is expected to exceed 50 percent, up from 30 percent this year, MediaTek added.
Shares of contract chipmaker Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) came under pressure yesterday after a report that Apple Inc is looking to shift some orders from the Taiwanese company to Intel Corp. TSMC shares fell NT$55, or 2.4 percent, to close at NT$2,235 on the local main board, Taiwan Stock Exchange data showed. Despite the losses, TSMC is expected to continue to benefit from sound fundamentals, as it maintains a lead over its peers in high-end process development, analysts said. “The selling was a knee-jerk reaction to an Intel-Apple report over the weekend,” Mega International Investment Services Corp (兆豐國際投顧) analyst Alex Huang
TRANSITION: With the closure, the company would reorganize its Taiwanese unit to a sales and service-focused model, Bridgestone said Bridgestone Corp yesterday announced it would cease manufacturing operations at its tire plant in Hsinchu County’s Hukou Township (湖口), affecting more than 500 workers. Bridgestone Taiwan Co (台灣普利司通) said in a statement that the decision was based on the Tokyo-based tire maker’s adjustments to its global operational strategy and long-term market development considerations. The Taiwanese unit would be reorganized as part of the closure, effective yesterday, and all related production activities would be concluded, the statement said. Under the plan, Bridgestone would continue to deepen its presence in the Taiwanese market, while transitioning to a sales and service-focused business model, it added. The Hsinchu
Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) has approved a capital budget of US$31.28 billion for production expansion to meet long-term development needs during the artificial intelligence (AI) boom. The company’s board meeting yesterday approved the capital appropriation plan for purposes such as the installation of advanced technology capacity and fab construction, the world’s largest contract chipmaker said in a statement. At an earnings conference last month, TSMC forecast that its capital expenditure for this year would be at the higher end of the US$52 billion to US$56 billion range it forecast in January in response to robust demand for 5G, AI and
Taiwan Semiconductor Manufacturing Co’s (TSMC, 台積電) investment project in Arizona has progressed better than expected, but it still faces challenges such as water and labor shortages, National Development Council (NDC) Minister Yeh Chun-hsien (葉俊顯) said yesterday. Speaking with reporters after visiting TSMC’s Arizona hub and attending the SelectUSA Investment Summit in Maryland last week, Yeh said TSMC’s Arizona site turned a profit of NT$16.14 billion (US$514 million) last year in its first full year of mass production. “TSMC told me it was surprised by the smooth trial run of the first fab, which has left the company optimistic about the project’s outlook,”