MediaTek Inc (聯發科), the nation’s biggest supplier of chips used in smartphones, plans to launch its new flagship 5G chip by February in a bid to capture a bigger share of the rapidly growing market, a company executive said yesterday.
The announcement indicates that the Hsinchu-based chipmaker is gaining confidence about the rollout of its new 5G chip designed for premium smartphones. The chipmaker two months ago gave a more vague schedule, saying that new phones powered by its new Dimensity 5G chip would enter mass production early next year.
The remarks came after the company’s bigger rival Qualcomm Inc last week unveiled its new flagship 5G chip, the Snapdragon 888, for premium smartphones.
Photo: Vanessa Cho, Taipei Times
MediaTek said that its chip would be launched by the Lunar New Year, which falls in February, and that it expects replacement demand to take off next year as shipments of 5G handsets worldwide are set to double from more than 200 million units this year.
The growth momentum is set to carry into 2023, with the 5G penetration rate expected to climb to about 60 percent from 49 percent in 2022, MediaTek chief executive Rick Tsai (蔡力行) said in a speech entitled “Accelerating the Digital Economy post the COVID-19 pandemic” at the IEEE Global Communications Conference in Taipei yesterday.
The 5G smartphone penetration rate is expected to reach 18 percent this year, beating MediaTek’s expectations, Tsai said.
The company’s strategy is to build a comprehensive product portfolio for smartphones with different price points, he said, adding that the chipmaker plans to roll out a new 5G system-on-a-chip for entry-level smartphones.
The company’s high-end Dimensity 1000 chip has been adopted by LG Electronics Inc for its new 5G smartphone for US consumers, while Oppo Mobile Telecommunications Corp (歐珀) launched its Reno 4Z smartphone using the Dimensity 800 in Europe this quarter.
Thanks to its higher bandwidth and low latency, 5G technology is being adopted in applications beyond smartphones, including routers, connected devices, automotive wireless communications and industrial Internet-of-Things applications, Tsai said.
Working from home, remote study and the stay-at-home economy has become the new norm due to the COVID-19 pandemic, he said, adding that the trend is set to stay even after the pandemic subsides.
MediaTek has introduced multiple chips to address those demands, he added.
The company in the third quarter posted a more than 40 percent growth in revenue across the board, including chips used in Chromebooks.
Pandemic-induced lockdowns and constraints on movement are boosting the digital economy, Tsai said.
Mobile network traffic is set to grow at an annual compound rate of 26 percent through 2022 from 2018, mostly driven by the streaming of videos, he said.
Local suppliers of Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) appear to be divided over whether they should follow the chipmaker and also set up production facilities in the US, after TSMC announced that it would increase its investment in Arizona. While some TSMC suppliers, including clean-room design service provider United Integrated Services Co (漢唐集成), have set up plants in the US, others, such as IC testing and analysis provider Materials Analysis Technology Inc (閎康科技), have hesitated to make the move because of high production costs in the US. TSMC on Tuesday announced that it would increase its planned US$12 billion investment in
Netherlands-based ASML Holding NV, a leading global supplier of semiconductor production equipment, is considering bringing its European suppliers to Taiwan, doubling down on its supply-chain deployment in the country, Vice Premier Shen Jong-chin (沈榮津) said yesterday. That follows ASML’s announcement that it would build manufacturing facilities in New Taipei City’s Linkou District (林口) to support international customers and the development of the semiconductor industry. RELOCATION Shen did not disclose details about ASML’s new efforts to relocate European supply chains to Taiwan. ASML is to begin construction on the New Taipei City project in July, Shen said during a speech at a technology forum
MORE ADVANCED CHIPS: The company is planning to build a second, 3-nanometer fab in Arizona, TSMC said ahead of a ‘tool-in’ ceremony at its first plant near Phoenix Apple Inc is to be the biggest customer of Taiwan Semiconductor Manufacturing Co’s (TSMC, 台積電) new Arizona factories, Apple CEO Tim Cook wrote on Twitter yesterday. “Apple silicon unlocks a new level of performance for our users. And soon, many of these chips can be stamped ‘Made in America.’ The opening of TSMC’s plant in Arizona marks a new era of advanced manufacturing in the US — and we are proud to become the site’s largest customer,” he wrote. Cook’s tweet came as TSMC held a “tool-in” ceremony for its US$12 billion wafer fab in Arizona on Tuesday, which marked the beginning
Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) is to build a wafer fab deploying 1 nanometer (nm) process technology at the Longtan (龍潭) campus of Hsinchu Science Park (新竹科學園區), Hsinchu Science Park Bureau Director-General Wayne Wang (王永壯) said yesterday. The bureau completed a pilot project in the middle of last month for the third expansion phase of the Longtan Science Park (龍潭科學園區) in Taoyuan to accommodate the new TSMC plant, Wang told a news conference. The pilot expansion project has been submitted to the National Science and Technology Council, which would next forward the project to the Cabinet for approval, Wang said. “The efforts