Taiwan's Advanced Semiconductor Engineering Inc (ASE, 日月光半導體), the world's biggest chip packager, yesterday said it had signed agreements with Japan's Mitsui High-tec Inc for cross licensing and cooperation in jointly developing advanced chip packaging technologies.
Under the cross-licensing agreement, ASE will share intellectual property rights and technological expertise (Mitsui's Hybrid Manufacturing Technologies, HMT) for the design and manufacture of chip packaging.
"This agreement will truly benefit our customers, who require cutting-edge packaging technologies to ensure their competitiveness in the dynamic semiconductor market," said Tong Ho-ming (
No financial details about the cross licensing agreement were disclosed.
"The collaboration will enable ASE and Mitsui to meet stringent market demands and bring added value to our customers worldwide," Tong said.
Both ASE and Mitsui have allocated expert engineering resources to expand and enhance HMT's functionality and leverage its advantages to bring added value to the semiconductor market.
ASE posted NT$445.72 million (US$13.49 million), or NT$0.95 per share, in net income for the first half of the year, down from NT$1.26 billion, or NT$2.39 a share, a year ago.
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