Passive components maker Walsin Technology Corp (華新科技) yesterday reported that pretax profit last quarter dropped 30.43 percent to NT$1.44 billion (US$47.37 million), from NT$2.07 billion the previous quarter, due to lower prices.
An outbreak of COVID-19 in China is expected to affect the global economy in the first two quarters of this year, which would create short-term headwinds for the company, according to a presentation Walsin prepared for an investors’ conference yesterday, which was not open to the media.
The company did not elaborate on the short-term effects of the epidemic.
In the presentation, Walsin said that 5G-enabled networking devices and automotive applications would continue to drive demand for passive components.
The company reported revenue of NT$29.94 billion for last year, with China, the biggest market, accounting for more than 70 percent of its total revenue.
Operating profit last quarter dropped 18.12 percent quarter-on-quarter from NT$1.49 billion to NT$1.22 billion, with operating margin dipping from 20.55 percent to 18.74 percent — the smallest quarterly contraction in about two years, as falling inventory and supply constraints helped buoy prices.
For last year as a whole, Walsin’s pretax profit plummeted about 65 percent to NT$8.97 billion, compared with NT$25.61 billion in 2018. Pretax earnings per share fell to NT$18.46, from a record high of NT$52.96.
Separately yesterday, Yageo Corp (國巨), the world’s third-largest supplier of chip resistors, said that a shortage of passive components has worsened, as few employees returned to work after the Lunar New Year holiday due to COVID-19-induced lockdowns in China.
Yageo said it hopes that the situation will improve at the end of this month, when more employees return to work.
The company originally aimed to lift factory utilization to about 70 percent next quarter, but said that it now faces difficulty boosting it due to the severe labor shortage, and clients are seeing inventories running at less-than-normal levels.
“The company’s top priority is to satisfy customer demand,” a Yageo official said by telephone.
Yageo declined to comment on local media reports about price hikes of between 70 percent and 80 percent for its chip resistors, starting next month.
The firm earlier this month raised prices by 50 percent for multilayer ceramic capacitors, the Chinese-language Economic Daily News reported yesterday, citing industry sources.
Yageo is scheduled to hold an extraordinary shareholders’ meeting today to sign off on a plan to issue 80 million new common shares in the form of global depository receipts.
With this year’s Semicon Taiwan trade show set to kick off on Wednesday, market attention has turned to the mass production of advanced packaging technologies and capacity expansion in Taiwan and the US. With traditional scaling reaching physical limits, heterogeneous integration and packaging technologies have emerged as key solutions. Surging demand for artificial intelligence (AI), high-performance computing (HPC) and high-bandwidth memory (HBM) chips has put technologies such as chip-on-wafer-on-substrate (CoWoS), integrated fan-out (InFO), system on integrated chips (SoIC), 3D IC and fan-out panel-level packaging (FOPLP) at the center of semiconductor innovation, making them a major focus at this year’s trade show, according
DEBUT: The trade show is to feature 17 national pavilions, a new high for the event, including from Canada, Costa Rica, Lithuania, Sweden and Vietnam for the first time The Semicon Taiwan trade show, which opens on Wednesday, is expected to see a new high in the number of exhibitors and visitors from around the world, said its organizer, SEMI, which has described the annual event as the “Olympics of the semiconductor industry.” SEMI, which represents companies in the electronics manufacturing and design supply chain, and touts the annual exhibition as the most influential semiconductor trade show in the world, said more than 1,200 enterprises from 56 countries are to showcase their innovations across more than 4,100 booths, and that the event could attract 100,000 visitors. This year’s event features 17
EXPORT GROWTH: The AI boom has shortened chip cycles to just one year, putting pressure on chipmakers to accelerate development and expand packaging capacity Developing a localized supply chain for advanced packaging equipment is critical for keeping pace with customers’ increasingly shrinking time-to-market cycles for new artificial intelligence (AI) chips, Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) said yesterday. Spurred on by the AI revolution, customers are accelerating product upgrades to nearly every year, compared with the two to three-year development cadence in the past, TSMC vice president of advanced packaging technology and service Jun He (何軍) said at a 3D IC Global Summit organized by SEMI in Taipei. These shortened cycles put heavy pressure on chipmakers, as the entire process — from chip design to mass
SEMICONDUCTOR SERVICES: A company executive said that Taiwanese firms must think about how to participate in global supply chains and lift their competitiveness Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) yesterday said it expects to launch its first multifunctional service center in Pingtung County in the middle of 2027, in a bid to foster a resilient high-tech facility construction ecosystem. TSMC broached the idea of creating a center two or three years ago when it started building new manufacturing capacity in the US and Japan, the company said. The center, dubbed an “ecosystem park,” would assist local manufacturing facility construction partners to upgrade their capabilities and secure more deals from other global chipmakers such as Intel Corp, Micron Technology Inc and Infineon Technologies AG, TSMC said. It