Chung-Hua Institution for Economic Research (CIER, 中華經濟研究院) yesterday announced that its chairman, Hu Sheng-cheng (胡勝正), had died of pulmonary calcification on Tuesday evening at National Taiwan University Hospital.
The 77-year-old widely respected academic was survived by his wife and two sons.
Hu had been frail and was recently hospitalized for flu symptoms, his secretary said by telephone.
Photo: Wang Meng-lun, Taipei Times
The Taipei-based think tank is setting up a makeshift memorial hall for people to pay tribute to Hu from today, she said.
With a doctoral degree in economics from the University of Rochester in the US, Hu took the helm of CIER in 2016 at the invitation of President Tsai Ing-wen (蔡英文). He concurrently served as a standing board director at the central bank.
Tsai said Hu’s death was a great loss to the nation.
A native of Yilan, Hu taught at Purdue University for 28 years before returning home to teach at National Taiwan University in 1996. In 2000 he was elected a member of Academia Sinica, the nation’s top research institute.
Hu joined the government in 2001, first serving as minister without portfolio and later heading the Council for Economic Planning and Development (renamed the National Development Council, NDC) and the Financial Supervisory Commission.
Hu had called on the local industry to transform and upgrade, replacing the “Made in Taiwan” model with the “Served by Taiwan” orientation, the NDC said in a statement.
Hu also pushed for equitable distribution of the nation’s wealth and resources, as well as advocated the need for balanced development between rural and urban areas, the council said.
The central bank described Hu as a gentle man, who remained positive even as his health deteriorated after a serious gastrointestinal ailment in 2016.
He passed out during a meeting at the Presidential Office in April last year and was rushed to Mackay Memorial Hospital.
Academics across the political spectrum mourned his death, expressing their admiration for his academic prowess.
Hu gave up a comfortable life in the US and demonstrated great courage by joining the government in a time of tumult, Taiwan Institute of Economic Research (台經院) president Lin Chien-fu (林建甫) said.
As the head of CIER, Hu said the institute would strive for better quality and forward-looking research to help the government, industry and society.
He showed particular concern about the nation’s rapidly aging population, which he said merited serious attention from policymakers and the public so that they could better grasp the issue and make adjustments.
With this year’s Semicon Taiwan trade show set to kick off on Wednesday, market attention has turned to the mass production of advanced packaging technologies and capacity expansion in Taiwan and the US. With traditional scaling reaching physical limits, heterogeneous integration and packaging technologies have emerged as key solutions. Surging demand for artificial intelligence (AI), high-performance computing (HPC) and high-bandwidth memory (HBM) chips has put technologies such as chip-on-wafer-on-substrate (CoWoS), integrated fan-out (InFO), system on integrated chips (SoIC), 3D IC and fan-out panel-level packaging (FOPLP) at the center of semiconductor innovation, making them a major focus at this year’s trade show, according
DEBUT: The trade show is to feature 17 national pavilions, a new high for the event, including from Canada, Costa Rica, Lithuania, Sweden and Vietnam for the first time The Semicon Taiwan trade show, which opens on Wednesday, is expected to see a new high in the number of exhibitors and visitors from around the world, said its organizer, SEMI, which has described the annual event as the “Olympics of the semiconductor industry.” SEMI, which represents companies in the electronics manufacturing and design supply chain, and touts the annual exhibition as the most influential semiconductor trade show in the world, said more than 1,200 enterprises from 56 countries are to showcase their innovations across more than 4,100 booths, and that the event could attract 100,000 visitors. This year’s event features 17
EXPORT GROWTH: The AI boom has shortened chip cycles to just one year, putting pressure on chipmakers to accelerate development and expand packaging capacity Developing a localized supply chain for advanced packaging equipment is critical for keeping pace with customers’ increasingly shrinking time-to-market cycles for new artificial intelligence (AI) chips, Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) said yesterday. Spurred on by the AI revolution, customers are accelerating product upgrades to nearly every year, compared with the two to three-year development cadence in the past, TSMC vice president of advanced packaging technology and service Jun He (何軍) said at a 3D IC Global Summit organized by SEMI in Taipei. These shortened cycles put heavy pressure on chipmakers, as the entire process — from chip design to mass
Germany is to establish its first-ever national pavilion at Semicon Taiwan, which starts tomorrow in Taipei, as the country looks to raise its profile and deepen semiconductor ties with Taiwan as global chip demand accelerates. Martin Mayer, a semiconductor investment expert at Germany Trade & Invest (GTAI), Germany’s international economic promotion agency, said before leaving for Taiwan that the nation is a crucial partner in developing Germany’s semiconductor ecosystem. Germany’s debut at the international semiconductor exhibition in Taipei aims to “show presence” and signal its commitment to semiconductors, while building trust with Taiwanese companies, government and industry associations, he said. “The best outcome