Asustek sets ‘ZenTalk’ date
Asustek Computer Inc (華碩) yesterday said it is to convene its annual “ZenTalk” conference in Taipei on Aug. 26 to showcase its upcoming flagship handset, the ZenFone 4, and its augmented reality (AR) smartphone, the ZenFone AR, to consumers. It is the third consecutive year the company has hosted the conference in the city, as part of the firm’s strategy to promote its smartphones and create a closer relationship with its consumers. Asustek said a “high-ranking” executive would personally introduce the features of the new products and dine with the participants. Asustek has not yet sent out invitations to the ZenFone 4 product launch after the company reportedly postponed it from the end of this month to the middle of next month.
Kinsus net income plunges
Kinsus Interconnect Technology Corp (景碩科技), a silicon substrate manufacturing arm of Pegatron Corp (和碩), yesterday reported net income of NT$63.39 million (US$2.09 million) for last quarter, down from the NT$603.32 million it made in the same period last year. Earnings per share were NT$0.14, compared with last year’s NT$1.35. The result brought the company’s combined net profit for the first half to NT$199.94 million, down from NT$1.11 billion last year, according to a company filing with the Taiwan Stock Exchange. The company has not yet set a date for its investors’ conference, at which it plans to announce its outlook for the remainder of this year.
Hon Hai in India talks
Hon Hai Precision Industry Co (鴻海精密) is in talks with a major industrial group in India to introduce low-end mobile phones in the nation, according to an Indian media report. The Economic Times reported over the weekend that Hon Hai, also known as Foxconn Technology Group (富士康), has entered into negotiations with Reliance Industries Ltd (RIL) to make low-priced mobile phones under Indian Prime Minister Narendra Modi’s “Make in India” initiative. The report said that Reliance Jio Infocomm, the telecom subsidiary of RIL, is planning to launch dual SIM mobile phones costing between US$23 and US$25. The report said that the mobile phones would be equipped with 2G and 4G SIM card slots and are expected to use chips designed by China’s Spreadtrum Communications Inc (展訊).
CSBC Corp delivers vessel
CSBC Corp, Taiwan (台灣國際造船) yesterday said that TS Lines Co (德翔海運) has taken delivery of a 1,800 twenty-foot equivalent unit Bangkok-max vessel that it was commissioned to design and build. Despite a downturn in the global cargo shipping sector, TS Lines is committed to updating its fleet and the company has three more of the vessels on order, CSBC Corp said. The new vessel is 25 percent more fuel efficient than vessels built 10 years ago, the shipbuilder said.
M1B grows 4.43 percent
M1B money supply, which refers to cash and cash equivalents, grew 4.43 percent year-on-year last month, faster than the broader gauge M2 — M1B, savings deposits, time savings deposits and foreign currency deposits — which grew 3.71 percent, the central bank said yesterday. As M1B is often linked to liquidity available for stock investments, the trend might reflect an upturn in investor confidence, as the two measures displayed a so-called “golden cross,” the bank said.
SELF-SUFFICIENCY: Alibaba is one of a number of Chinese firms that has answered Beijing’s call to invest in the development of cutting-edge technologies Alibaba Group Holding Ltd (阿里巴巴) yesterday unveiled a new server chip that is based on advanced 5-nanometer technology, marking a milestone in China’s pursuit of semiconductor self-sufficiency. The Chinese tech giant’s newest chip is based on micro-architecture provided by the SoftBank Group Corp-owned Arm Ltd, it said. Alibaba, which is holding its annual cloud summit in Hangzhou, China, said that the chip is to be used in its own data centers in the “near future” and would not, for the time being, be sold commercially. “Customizing our own server chips is consistent with our ongoing efforts toward boosting our computing capabilities with better
Production at Taiwan Semiconductor Manufacturing Corp’s (TSMC, 台積電) fabs was not affected by a fire at a construction site for a water recycling facility in the Southern Taiwan Science Park in Tainan. The world’s biggest contract chipmaker said that the construction site is not adjacent to its fabs, which were unaffected. CTCI Corp (中鼎工程) is responsible for the construction of the facility, which it is to operate itself once it is completed, the chipmaker said. The facility caught fire at about 11am, and the blaze was brought under control about 30 minutes after the incident was reported, the Southern Taiwan Science Park Administration
‘SHORT-TERM ECONOMIC PAIN’: A military takeover would only temporarily weigh on wafer production on both sides of the Taiwan Strait, IC Insights said Taiwan has more chip manufacturing capacity than any other economy in the world, US-based market information advisory firm IC Insights said in a research paper last week, cautioning that the nation’s strength could prompt China to attempt to take over Taiwan. Taiwan commanded 21.4 percent of global installed IC capacity, ahead of South Korea’s 20.4 percent, Japan’s 15.8 percent and China’s 15.3 percent, North America’s 12.6 percent and Europe’s 5.7 percent, IC Insights said. Taiwan is one of two countries that uses 10-nanometer technology or better to produce wafers, holding 62.8 percent of global capacity, with South Korea holding the remaining 37.2
AGGRESSIVE STEP: With the new processors, Apple is aiming at the high-end chips Intel has provided for the MacBook Pro and other top-end Macs for about 15 years Apple Inc on Monday took the most aggressive step yet to strip Intel Corp chips from its computers, announcing more powerful homegrown Mac processors alongside a total revamp of its MacBook Pro laptop computers. The company showcased the chips at an event called “Unleashed,” which also included its latest audio products. The new components, called the M1 Pro and M1 Max chips, are 70 percent faster than its M1 predecessors, Apple said. It also unveiled a redesigned MacBook Pro, adding larger screens, MagSafe charging and better resolution. With the new processors and devices, Apple is aiming squarely at the high-end chips that Intel has