CSBC Corp Taiwan (台船) yesterday said it has completed a NT$120 million (US$3.89 million) project to upgrade one of its docks with improved weight-bearing capabilities to tap into opportunities from the emerging offshore wind energy industry and military contracts.
At the Port of Kaohsiung, the weight-bearing capacity of the work area has been raised from 2 tonnes per square meter to 30 tonnes, making it able to withstand heavy components, the company said.
The facility is the first of its kind in Taiwan and opens the door for CSBC to tap into the demand for subsea structures, a key aspect of the nation’s offshore wind energy industry that raises turbines and substations above sea level, the company said.
Specifically, the company is looking to build subsea pin pile foundations and transition pieces that connect turbines to their foundations, the company said.
Two 50-tonne capacity wharves in the Port of Taichung would primarily handle heavier components such as turbines and substations, while a similar facility in Kaohsiung’s Singda Harbor would not be ready to go online until the middle of next year, the company said.
It has also converted a cold steel working plant into a multi-use office complex to house new departments dedicated to the government’s initiative to create indigenous naval vessels, CSBC said.
Nvidia Corp’s demand for advanced packaging from Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) remains strong though the kind of technology it needs is changing, Nvidia CEO Jensen Huang (黃仁勳) said yesterday, after he was asked whether the company was cutting orders. Nvidia’s most advanced artificial intelligence (AI) chip, Blackwell, consists of multiple chips glued together using a complex chip-on-wafer-on-substrate (CoWoS) advanced packaging technology offered by TSMC, Nvidia’s main contract chipmaker. “As we move into Blackwell, we will use largely CoWoS-L. Of course, we’re still manufacturing Hopper, and Hopper will use CowoS-S. We will also transition the CoWoS-S capacity to CoWos-L,” Huang said
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INDUSTRY LEADER: TSMC aims to continue outperforming the industry’s growth and makes 2025 another strong growth year, chairman and CEO C.C. Wei says Taiwan Semiconductor Manufacturing Co (TSMC, 台積電), a major chip supplier to Nvidia Corp and Apple Inc, yesterday said it aims to grow revenue by about 25 percent this year, driven by robust demand for artificial intelligence (AI) chips. That means TSMC would continue to outpace the foundry industry’s 10 percent annual growth this year based on the chipmaker’s estimate. The chipmaker expects revenue from AI-related chips to double this year, extending a three-fold increase last year. The growth would quicken over the next five years at a compound annual growth rate of 45 percent, fueled by strong demand for the high-performance computing
TARIFF TRADE-OFF: Machinery exports to China dropped after Beijing ended its tariff reductions in June, while potential new tariffs fueled ‘front-loaded’ orders to the US The nation’s machinery exports to the US amounted to US$7.19 billion last year, surpassing the US$6.86 billion to China to become the largest export destination for the local machinery industry, the Taiwan Association of Machinery Industry (TAMI, 台灣機械公會) said in a report on Jan. 10. It came as some manufacturers brought forward or “front-loaded” US-bound shipments as required by customers ahead of potential tariffs imposed by the new US administration, the association said. During his campaign, US president-elect Donald Trump threatened tariffs of as high as 60 percent on Chinese goods and 10 percent to 20 percent on imports from other countries.
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