Taiwan Semiconductor Manufacturing Co (TSMC, 台積電), the world’s biggest contract chipmaker, yesterday said that its board had approved a budget of US$803.76 million for research and development for next year.
The funding will be part of the chipmaker’s efforts to establish itself as a provider of technology and capacity to the global chip industry for years to come, a goal unveiled by company chairman and chief executive Morris Chang (張忠謀) on Oct. 28.
“Our strategy is to strengthen our technological leadership,” he said.
TSMC planned to increase overall R&D expenses to US$1.1 billion next year from US$945 million this year and US$657 million last year.
The chipmaker said earlier this year that it planned to budget a record high US$5.9 billion on capital spending this year and that spending could be bigger next year.
The board also gave the go-ahead for capital appropriations worth US$1.88 billion to set up mini-lines at its new Taichung plant, expand advanced technology capacity and increase 12-inch capacity for wafer-level chip-scale packaging and specialty technology capacity.
This year, TSMC expects capacity to expand 14 percent to 11.33 million 8-inch equivalent wafers, from 9.96 million 8-inch equivalent wafers last year. Advanced capacity is expected to grow 37 percent year-on-year.
The board also approved 9.4 million euro injection into TSMC’s new solar subsidiary in Europe.
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