Dassault Systemes SA (DS), the worldwide product life cycle management (PLM) leader, experienced sales growth last year of 52 percent in Taiwan across its four major industry focus groups, it said yesterday.
For this year, the software company, which specializes in 3D simulation and PLM, forecast 30 percent year-on-year revenue growth for Taiwan market with the majority of its businesses coming from automobile, aerospace, electrical engineering and industrial engineering industries, with a breakdown of 34 percent, 28 percent, 27 percent and 10 percent respectively, it said.
Although global corporations are cutting their capital expenditure budgets, Bernard Parrenin, Dassault Systemes’ general manager of PLM Taiwan, is confident that with DS’ new V6R2009x PLM platform, incorporating 3D simulation, collaborative innovation, virtual design and testing, as well as digital production, the software company will attract even more local clients this year as companies re-invent themselves during periods of distress.
“For this year, we will focus on strengthening relationships with our installed base, promoting solutions in business management, providing end-to-end integrated solutions and continuing our high technology expertise through sub-segment focus,” Perrenin told reporters yesterday.
“We have been selected by CIMdata as the global PLM leader for three years in a row because we’re truly the only company helping our clients from concept to market. We add tremendous value to Taiwanese companies because we focus solely on the user experience,” he said.
Although it has flown under the radar, the French software group shared some of its star-studded client list including Asustek Computer Inc (華碩電腦), Aerospace Industrial Development Corp (漢翔航空), Global Unichip Corp (創意電子), Hua-chuan SSG Automobile Information Technical Center (華創車電) and FullConn Industry Inc (全康精密).
Dassault Systemes has been able to witness compounded annual growth rates averaging 17 percent for the last five years. Worldwide, Dassault earned US$1.97 billion last year with 8,000 employees and 100,000 customers globally.
In terms of global market share, Dassault ranks No. 1, followed by Siemens AG, Parametric Technology Corp, SAP AG and Oracle Corp.
Zhang Yazhou was sitting in the passenger seat of her Tesla Model 3 when she said she heard her father’s panicked voice: The brakes do not work. Approaching a red light, her father swerved around two cars before plowing into a sport utility vehicle and a sedan, and crashing into a large concrete barrier. Stunned, Zhang gazed at the deflating airbag in front of her. She could never have imagined what was to come: Tesla Inc sued her for defamation for complaining publicly about the vehicles brakes — and won. A Chinese court ordered Zhang to pay more than US$23,000 in
‘LEGACY CHIPS’: Chinese companies have dramatically increased mature chip production capacity, but the West’s drive for secure supply chains offers a lifeline for Taiwan When Powerchip Technology Corp (力晶科技) entered a deal with the eastern Chinese city of Hefei in 2015 to set up a new chip foundry, it hoped the move would help provide better access to the promising Chinese market. However, nine years later, that Chinese foundry, Nexchip Semiconductor Corp (合晶集成), has become one of its biggest rivals in the legacy chip space, leveraging steep discounts after Beijing’s localization call forced Powerchip to give up the once-lucrative business making integrated circuits for Chinese flat panels. Nexchip is among Chinese foundries quickly winning market share in the crucial US$56.3 billion industry of so-called legacy
Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) yesterday held its first board of directors meeting in the US, at which it did not unveil any new US investments despite mounting tariff threats from US President Donald Trump. Trump has threatened to impose 100 percent tariffs on Taiwan-made chips, prompting market speculation that TSMC might consider boosting its chip capacity in the US or ramping up production of advanced chips such as those using a 2-nanometer technology process at its Arizona fabs ahead of schedule. Speculation also swirled that the chipmaker might consider building its own advanced packaging capacity in the US as part
‘NO DISRUPTION’: A US trade association said that it was ready to work with the US administration to streamline the program’s requirements and achieve shared goals The White House is seeking to renegotiate US CHIPS and Science Act awards and has signaled delays to some upcoming semiconductor disbursements, two sources familiar with the matter told reporters. The people, along with a third source, said that the new US administration is reviewing the projects awarded under the 2022 law, meant to boost US domestic semiconductor output with US$39 billion in subsidies. Washington plans to renegotiate some of the deals after assessing and changing current requirements, the sources said. The extent of the possible changes and how they would affect agreements already finalized was not immediately clear. It was not known
RSS