Minister of Economic Affairs Lin Yi-fu (林義夫) said yesterday that his ministry hopes to build Tai-wan into an Asian research and innovation hub for certain specific industries by 2008.
In a speech at a meeting sponsored by a Taipei chapter of Rotary International, Lin said his ministry is in charge of seven of the 10 key development projects outlined in February by the Cabinet in its "Challenge 2008, a six-year national development plan."
In addition to turning Taiwan into a research and innovation center, Lin said, the six other objectives are to promote creative culture, increase industrial added value, make Taiwan into a "digital country," build Taiwan into a business operational center, make Taiwan "green and friendly" and advocate a "new hometown" community spirit.
"In a bid to boost Taiwan's participation in the global village and help the country deploy global market strategies, we must step up research and innovation," he said, adding that the Cabinet will provide NT$50 billion (US$1.5 billion) in low-interest loans for the private sector to strengthen R&D until it accounts for 3 percent of GDP -- a similar level to developed countries -- by 2008.
Lin said Taiwan will see a strong demand for talent in IC design and digitally related industries and he vowed to ensure training for a large amount of new blood in all sectors.
Lin also said his ministry has plans to set up a software park in Taipei's Nankang district and a nanotechnolgy research and application center in Hsinchu.
To help foster technological development in small businesses, the ministry is also planning to open an "Asian innovation cen-ter," he added.
The New Taiwan dollar is on the verge of overtaking the yuan as Asia’s best carry-trade target given its lower risk of interest-rate and currency volatility. A strategy of borrowing the New Taiwan dollar to invest in higher-yielding alternatives has generated the second-highest return over the past month among Asian currencies behind the yuan, based on the Sharpe ratio that measures risk-adjusted relative returns. The New Taiwan dollar may soon replace its Chinese peer as the region’s favored carry trade tool, analysts say, citing Beijing’s efforts to support the yuan that can create wild swings in borrowing costs. In contrast,
Nvidia Corp’s demand for advanced packaging from Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) remains strong though the kind of technology it needs is changing, Nvidia CEO Jensen Huang (黃仁勳) said yesterday, after he was asked whether the company was cutting orders. Nvidia’s most advanced artificial intelligence (AI) chip, Blackwell, consists of multiple chips glued together using a complex chip-on-wafer-on-substrate (CoWoS) advanced packaging technology offered by TSMC, Nvidia’s main contract chipmaker. “As we move into Blackwell, we will use largely CoWoS-L. Of course, we’re still manufacturing Hopper, and Hopper will use CowoS-S. We will also transition the CoWoS-S capacity to CoWos-L,” Huang said
Nvidia Corp CEO Jensen Huang (黃仁勳) is expected to miss the inauguration of US president-elect Donald Trump on Monday, bucking a trend among high-profile US technology leaders. Huang is visiting East Asia this week, as he typically does around the time of the Lunar New Year, a person familiar with the situation said. He has never previously attended a US presidential inauguration, said the person, who asked not to be identified, because the plans have not been announced. That makes Nvidia an exception among the most valuable technology companies, most of which are sending cofounders or CEOs to the event. That includes
INDUSTRY LEADER: TSMC aims to continue outperforming the industry’s growth and makes 2025 another strong growth year, chairman and CEO C.C. Wei says Taiwan Semiconductor Manufacturing Co (TSMC, 台積電), a major chip supplier to Nvidia Corp and Apple Inc, yesterday said it aims to grow revenue by about 25 percent this year, driven by robust demand for artificial intelligence (AI) chips. That means TSMC would continue to outpace the foundry industry’s 10 percent annual growth this year based on the chipmaker’s estimate. The chipmaker expects revenue from AI-related chips to double this year, extending a three-fold increase last year. The growth would quicken over the next five years at a compound annual growth rate of 45 percent, fueled by strong demand for the high-performance computing