Hitachi-UMC joint venture delivers first order of chips

Trecenti Technologies, the world's first factory to exclusively make 300mm silicon wafers, said it delivered its first major order to Xilinx Inc, the largest manufacturer of programmable semiconductors.

Based north of Tokyo, Trecenti, a joint venture between Hitachi Ltd and United Microelectronics Corp (UMC, 聯電), didn't disclose the size of the

order.

The first commercial production of 300mm silicon wafers gives Hitachi and UMC an edge over rivals such as Taiwan Semiconductor Manufacturing Co (TSMC, 台積電), which has announced plans to make wafers using the same technology.

"The main advantage of the new technology is you can get more chips on a 300mm wafer, helping save costs and increase productivity," said Alex Hinnawi, a UMC spokesman. "Until now it was an unproven technology."

Hitachi helped develop the new technology and invited UMC to take a stake in the venture to share the risk and costs, he said.