Advanced Semiconductor Engineering Inc (ASE, 日月光半導體) plans to spend NT$28.2 billion (US$955.87 million) to build two factories in Greater Kaohsiung and one research and development building to meet growing customer demand for smartphones, tablets and game consoles, the Ministry of Economic Affairs said.
ASE, the world’s biggest chip packager, said it plans to build six plants within the next five years, including the ones already under construction, to expand its global market share to 25 percent, the ministry said in a statement released on Friday.
The expansion also allows Kaohsiung-based ASE to seize more business opportunities from increasing outsourcing from chip companies, the ministry said.
The capacity expansion plan would increase ASE’s hiring by 3,000 people each year, it said.
ASE held a groundbreaking ceremony for the facilities on Friday.
Vice Minister of Economic Affairs Hwang Jung-chiou (黃重球) said its expansion in capacity and research and development programs would strengthen the company’s leading position in the industry by enhancing its high-end chip packaging technologies.
In addition, it will significantly boost commercial activities in Kaohsiung, Huang said.
ASE plans to spend between US$700 million and US$750 million on new equipment this year, down between 4 percent and 10.25 percent from last year’s US$780 million.