Taiwan Semiconductor Manufacturing Co (TSMC, 台積電), the world’s largest contract chipmaker, said yesterday that it is working with Germany-based Dialog Semiconductor on a new technology for power management integrated circuits (PMIC).
TSMC said in a statement that the two companies are jointly developing the next generation of high-performance power management chips specifically tailored for portable devices.
The chips will use a technology known as BCD, which combines bipolar -complementary -metal oxide semiconductors and -double--diffused metal oxide semiconductors.
The chipmaker said its 0.13 micron process is being applied to BCD technologies and that it is working with Dialog Semiconductor on power management chip production.
TSMC said the BCD process would support the integration of advanced logic, analog and high-voltage features, while also -enabling Dialog Semiconductor to create highly integrated, smaller-form-factor, single-chip devices for portable products, such as tablet PCs, Ultrabooks and smartphones.
“Through close collaboration with TSMC, we succeeded in increasing our chip shipments by a staggering 61 percent last year, while at the same time accelerating the development of our next generation of PMICs through this BCD process partnership,” Dialog Semiconductor chief executive Jalal Bagherli said in a statement.