"IBM is strong in fab technology, but if we look at mass production capability, Taiwan is better than IBM," said Alfred Ying (應宗傑), an analyst at BNP Paribas in Taipei.
Ying estimated that half of IBM's 12-inch capacity of 10,000 wafers each month has been set aside for outside customers, much less than TSMC and UMC which have a capacity of between 7,000 and 10,000 12-inch wafers each. TSMC and UMC can also use their 8-inch facilities to make 0.13-micron chips, thereby increasing their capacity.
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