Tue, Mar 12, 2002 - Page 17 News List

Infineon strikes up deal with Winbond and Mosel Vitelic

DPA , MUNICH

German semiconductor company Infineon Technologies, anticipating a market recovery, announced yesterday deals with Winbond Electronics Corp (華邦電子) and Mosel Vitelic Inc (茂矽) to expand production capacity in Taiwan.

Infineon said it signed a non-binding memorandum of understanding with Winbond and agreements with Mosel Vitelic -- both located in Hsinchu -- in deals to boost its total production capacity for DRAM chips by more than 20,000 wafer starts per month.

Under the terms of the memorandum with Winbond, Infineon will license its advanced DRAM trench technology to Winbond.

Under the agreement with Mosel Vitelic, Infineon is increasing its share in the output of their joint venture ProMOS Technologies Inc (茂德科技) from 38 to 48 percent as of March 1.

"Executing on our strategy to further strengthen our ties with Taiwanese partners, Infineon considers these cooperations as a major step to prepare for the upcoming market recovery," Infineon president Ulrich Schumacher said.

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